A performance leading DDR PHY that supports DDR4/LPDDR4/DDR3/LPDDR3/DDR2/LPDDR2/DDR at speeds up to 2800Mb/s and in any bus width.

Silicon proven in volume manufacturing, and test chips, the PHY combines low power consumption with its small size. This compact form factor translates into low I/O pin count, simplifying both package substrate and PCB. Potentially allowing for board level routing using only 2 layers.

Leveraging a choice of DFI V2.0/V2.1/V3.0/V3.1 standards, the PHY can be integrated with our companion memory controller or major compatible 3rd party options. It is fully register controlled via an APB and production testing is simplified through at-speed BIST, loopback modes, and boundary scan.

A self-contained, but modular design, the PHY contains the I/Os, ESD, a timing synch module DLLs and can be expanded to a virtually unlimited bus width. Optional components include: customer specific bus widths, integrated PLLs, custom pinouts, and the Innosilicon memory controller which supports AHB/AXI and FIFO interfaces. We can create the custom DDR solution that meets your needs while handling whatever level of integration support you require.


  • Fully compliant with DDR4/LPDDR4/DDR3 /LPDDR3/DDR2/LPDDR2/DDR JEDEC SDRAM standards
  • Silicon proven in 14, 28, 40, 55, 65, 90, 130 and 180nm across SMIC, TSMC and Global Foundries
  • Low power, small area, scalable design
  • Supports speeds up to 4000 Mb/s
  • LVSTL, SSTL_15, SSTL_18 and POD12
  • Programmable output drive strength for power saving and to support RDIMM or UDIMM
  • Master and Slave DLLs for precise timing management with fine grain adjustment
  • Accommodates, but is not limited to, industry standard x4, x8, x16, x32 SDRAM widths and depths
  • Low power operation with optimal power management features including deep power down and self-refresh
  • Optimized look ahead command management to reduce system overhead
  • Process, voltage and temperature drift compensation through auto-calibration
  • Embedded BIST logic for at-speed production test
  • Optional PCB SI simulation services available
  • Optional memory controller that supports efficient AXI/AHB CPU bus and power saving modes


  • Simple integration with pre-assembled PHY
  • Fully customized solutions
  • Low IO pin count
  • Compatible with 2 layer PCB's
  • High performance with low power modes
  • Test chip and FPGA integration services available



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 What package can you choose?
  • Supports small form-factor LQFP/LQFN
  • Supports wirebond BGA and flipchip BGA
  • Supports two layer PCB
 What makes our DDR different?
  • Easy to integrate, fully pre-assembled PHY
  • Low IO pin count
  • 2 layer PCB supported
  • Very high performance with low power modes
  • Test chip and FPGA integration service available
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