USB 3.0 PHY (Host-Device-OTG-Hub)

The INNOSILICON USB 3.0 PHY is fully spec compliant. Combining the efficiency of a mature, but compact, USB 2.0 PHY with a Super Speed PHY to provide 5Gb/s operation, this complete solution is the answer to your USB 3.0 needs.

Streamlined production testing is supported through BIST, multiple loopback modes and boundary scan.

Its modular nature is flexible, ensuring a PHY combination that is able to support the latest in C-type connector configurations while including all the I/Os, ESD in a single drop-in block. As with all Innosilicon IP, our USB 3.0 solution is fully customizable to meet your specific needs.

KEY FEATURES:

  • Supports 5.0Gb/s serial data transmission rate
  • Utilizes 8-bit, 16-bit or 32- bit parallel interface to transmit and receive USB SuperSpeed data
  • Allows integration of high speed components into a single functional block as seen by the device designer.
  • Data and clock recovery from serial stream on the USB SuperSpeed bus
  • Holding registers to stage transmit and receive data
  • Supports direct disparity control for use in transmitting compliance pattern
  • 8b/10b encode/decode and error indication
  • Receiver detection
  • Low Frequency Periodic Signaling ( LFPS) Transmission
  • Selectable Tx Margining
  • one PHY support 3 protocols (sbared pMA)

INNOSILICON ADVANTAGES:

  • Small die size
  • Low pin counts
  • Low power consumption
  • Fully customizable

BLOCK DIAGRAM:

EXAMPLE APPLICATIONS:

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USB 3.0 Q&A

 What package can you choose?
  • Supports small form-factor LQFP/LQFN; Supports BGA
 What makes our USB 3.0 different?
  • Supports multi-protocol combo design of SATA/PCIe/U3/XAUI/FC
  • Supports multi-channel design, sharing common module to reduce die size and package pin number
  • Compatible with various types of package, such as LQFP/LQFN, WB/FC, and BGA
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